AMD on Nasdaq

AMD

Logo: Advanced Micro Devices, Inc., Public domain, via Wikimedia Commons6

American multinational semiconductor company

Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company headquartered in Santa Clara, California. It develops central processing units (CPUs), graphics processing units (GPUs), field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and high-performance computer components. AMD serves a wide range of business and consumer markets, including personal computers (PCs), gaming, data centers, and embedded systems.3 It was founded by Jack Gifford, Jerry Sanders and Edwin Turney.1 Its chief executive is Lisa Su (since 2014).1 It employed about 28,000 people in 2025.1 Its revenue was $34.6 billion in 2025.1 Wikipedia text CC BY-SA 4.0

$529.23 down 33.00 (5.87%)Price as of Oct 16, 2026 at 19:58 UTC

Last updated Oct 21, 2026.

Overview

May 1, 1969Founded1

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  • TickerAMD on Nasdaq1
  • Industrycomputer industry, electrical industry, semiconductor industry1
  • HeadquartersSanta Clara1
  • Founded inSunnyvale1
  • Websitewww.amd.com
  • Legal formDelaware corporation1
  • Listed onMoscow Exchange, Nasdaq (AMD)1
  • Incorporated inDE7
  • Business address2485 Augustine Drive, Santa Clara, Ca 950547
  • Filer categoryLarge accelerated filer7
  • LEIR2I72C950HOYXII453664
  • StatusActive4
  • LEI statusIssued and current4
  • Registered addressC/O THE CORPORATION TRUST COMPANY, 19801 Wilmington, United States4
  • Registered withDivision of Corporations, Department of State, 7115244
2485 Augustine Drive headquarters in Santa Clara, California
Photo: Coolcaesar, CC BY-SA 4.0, via Wikimedia Commons10

Advanced Micro Devices, Inc. (AMD) is an American multinational semiconductor company headquartered in Santa Clara, California. It develops central processing units (CPUs), graphics processing units (GPUs), field-programmable gate arrays (FPGAs), system-on-chips (SoCs), and high-performance computer components. AMD serves a wide range of business and consumer markets, including personal computers (PCs), gaming, data centers, and embedded systems.3

Financials

From the company’s reports to the SEC. Every number links to the filing it came from.

Key numbers, fiscal 2025

49.5%Gross margin11
10.7%Operating margin11
12.5%Net margin11
34.3%Revenue growth, 202511
6.9%Return on equity11
0.04×Debt to equity11
$6.7BFree cash flow11

What sells

Revenue by product, business segment and region, as the company reports it to the SEC.

Business segments

Datacenter brought in 48% of the revenue AMD broke down this way in fiscal 2025.

  1. Datacenter$16.6B1148%up 32% from 2024
  2. Client and Gaming$14.6B1142%up 51% from 2024
  3. Embedded$3.5B1110%down 3% from 2024
Business segments by year
Business segments202320242025
Datacenter$6.5B$12.6B$16.6B
Client and Gaming$10.9B$9.6B$14.6B
Embedded$5.3B$3.6B$3.5B

Regions

United States brought in 33% of the revenue AMD broke down this way in fiscal 2025.

  1. United States$11.4B1133%up 31% from 2024
  2. China$7.8B1122%up 24% from 2024
  3. Other Countries$6.1B1117%up 53% from 2024
  4. Taiwan$5.2B1115%up 57% from 2024
  5. Singapore$4.3B1112%up 19% from 2024
Regions by year
Regions202320242025
United States$7.8B$8.7B$11.4B
China$3.4B$6.2B$7.8B
Other Countries$7.4B$3.9B$6.1B
Taiwan$1.8B$3.3B$5.2B
Singapore$2.2B$3.6B$4.3B

Where the money goes

Where each dollar of revenue went, fiscal 2025

  • Cost of revenue50¢$17.5B
  • Research and development23¢$8.1B
  • Selling, general and admin12¢$4.1B
  • Other costs1¢$348.0M
  • Interest0¢$131.0M
  • Income tax0¢$103.0M
  • Profit13¢$4.3B

Out of $34.6B in revenue.11

Where each dollar of operating cash went, fiscal 2025

  • Capital spending13¢$974.0M
  • Share buybacks17¢$1.3B
  • Kept or used elsewhere70¢$5.4B

Out of $7.7B of cash from operations.11

Financial statements

Revenue1213141511$34.6B in 2025+415% since 2019
0$10.0B$20.0B$30.0B$40.0B2019: $6.7B$6.7B20192020: $9.8B$9.8B2020+45%2021: $16.4B$16.4B2021+68%2022: $23.6B$23.6B2022+44%2023: $22.7B$22.7B2023−4%2024: $25.8B$25.8B2024+14%2025: $34.6B$34.6B2025+34%
Gross profit1213141511$17.2B in 2025+498% since 2019
0$5.0B$10.0B$15.0B$20.0B2019: $2.9B$2.9B20192020: $4.3B$4.3B2020+52%2021: $7.9B$7.9B2021+82%2022: $10.6B$10.6B2022+34%2023: $10.5B$10.5B2023−1%2024: $12.7B$12.7B2024+22%2025: $17.2B$17.2B2025+35%
Operating income1213141511$3.7B in 2025+485% since 2019
0$1.0B$2.0B$3.0B$4.0B2019: $631.0M$631.0M20192020: $1.4B$1.4B2020+117%2021: $3.6B$3.6B2021+166%2022: $1.3B$1.3B2022−65%2023: $401.0M$401.0M2023−68%2024: $1.9B$1.9B2024+374%2025: $3.7B$3.7B2025+94%
Net income1213141511$4.3B in 2025+1171% since 2019
0$2.0B$4.0B$6.0B2019: $341.0M$341.0M20192020: $2.5B$2.5B2020+630%2021: $3.2B$3.2B2021+27%2022: $1.3B$1.3B2022−58%2023: $854.0M$854.0M2023−35%2024: $1.6B$1.6B2024+92%2025: $4.3B$4.3B2025+164%

Every line of the income statement as filed: the last 3 fiscal years, latest first.11

Period ending2025-12-312024-12-312023-12-31
Net revenue$34.6B$25.8B$22.7B
Cost of sales$16.5B$12.1B$11.3B
Amortization of acquisition-related intangibles- COGS$1.0B$946.0M$942.0M
Total cost of sales$17.5B$13.1B$12.2B
Gross profit$17.2B$12.7B$10.5B
Research and development$8.1B$6.5B$5.9B
Marketing, general and administrative$4.1B$2.7B$2.3B
Amortization of acquisition-related intangibles$1.2B$1.4B$1.9B
Restructuring charges$0$186.0M$0
Total operating expenses$13.5B$10.8B$10.1B
Operating income$3.7B$1.9B$401.0M
Interest expense-$131.0M-$92.0M-$106.0M
Other income (expense), net$577.0M$181.0M$197.0M
Income from continuing operations before income taxes and equity income$4.1B$2.0B$492.0M
Income tax provision (benefit)-$103.0M$381.0M-$346.0M
Equity income in investee$26.0M$33.0M$16.0M
Income (Loss) from Continuing Operations, Net of Tax, Attributable to Parent$4.3B$1.6B$854.0M
Income (Loss) from Discontinued Operations, Net of Tax, Attributable to Parent$66.0M$0$0
Net income$4.3B$1.6B$854.0M
Income (Loss) from Continuing Operations, Per Basic Share$3$1$1
Income (Loss) from Discontinued Operations and Disposal of Discontinued Operations, Net of Tax, Per Basic Share$0$0$0
Basic (in usd per share)$2.67$1.01$0.53
Income (Loss) from Continuing Operations, Per Diluted Share$3$1$1
Income (Loss) from Discontinued Operations and Disposal of Discontinued Operations, Net of Tax, Per Diluted Share$0$0$0
Diluted (in usd per share)$2.65$1.00$0.53
Basic (in shares)1.6B shares1.6B shares1.6B shares
Diluted (in shares)1.6B shares1.6B shares1.6B shares

Compare AMD with another company

Corporate structure

AMD sits at the top of its group. 87 entities, 28 countries on record. Switch between the flow chart and the network, and select any entity to see its details.

Major holders of AMD

  • AMD Wilmington, Delaware, United States
    • SeaMicro Subsidiary · Santa Clara
    • Spansion Subsidiary · Sunnyvale, California, United States
    • ATI Technologies ULC Subsidiary · 100% · Canada
    • Advanced Micro Devices (Canada) Subsidiary · Canada
    • Advanced Micro Devices (China) Co., Ltd. Subsidiary · China
    • Advanced Micro Devices (Poland) sp. z o.o. Subsidiary · Poland
    • Advanced Micro Devices (Shanghai) Co., Ltd. Subsidiary · China
    • Advanced Micro Devices (Singapore) Pte. Ltd. Subsidiary · Singapore
    • Advanced Micro Devices (Spain), S.L. Subsidiary · Spain
    • Advanced Micro Devices (U.K.) Limited Subsidiary · United Kingdom
    • Advanced Micro Devices AB Subsidiary · Sweden
    • Advanced Micro Devices Belgium N.V. Subsidiary · Belgium
    • Advanced Micro Devices CH GmbH Subsidiary · Switzerland
    • Advanced Micro Devices Global Services (M) Sdn. Bhd. Subsidiary · Malaysia
    • Advanced Micro Devices Malaysia Ltd. Subsidiary · Malaysia
    • Advanced Micro Devices Products (China) Co., Ltd. Subsidiary · China
    • Advanced Micro Devices RS d.o.o. Subsidiary · Serbia
    • Advanced Micro Devices S.A.S. Subsidiary · France
    • AMD (EMEA) LTD. Subsidiary · Delaware, United States
    • AMD Advanced Micro Devices (ROU) S.R.L. Subsidiary · Romania
    • AMD Advanced Research, LLC Subsidiary · Delaware, United States
    • AMD Design, LLC Subsidiary · Delaware, United States
    • AMD Far East Ltd. Subsidiary · Delaware, United States
    • AMD Federal Technologies, LLC Subsidiary · Delaware, United States
    • AMD INDIA PRIVATE LIMITED Subsidiary · Bangalore, India
    • and 64 more

Built from parent and subsidiary links from GLEIF, the Global Legal Entity Identifier Foundation (CC0); subsidiaries listed in Exhibit 21 of annual reports filed with the SEC; subsidiaries, stakes and holdings from Wikidata (CC0); major holders from Schedules 13D and 13G. Each entity in the chart links to its source.

What it owns

What AMD reports owning in its annual reports to the SEC: buildings, land and equipment, real estate and locations, investments, intangible assets and inventory, at the end of its latest fiscal year and a year before.

Property and equipment

ItemLatestA year beforeChange
Machinery and equipment$3.5B11 Dec 27, 2025$2.8B11 Dec 28, 2024+23.4%
Leasehold improvements$967.0M11 Dec 27, 2025$853.0M11 Dec 28, 2024+13.4%
Construction in progress$508.0M11 Dec 27, 2025$324.0M11 Dec 28, 2024+56.8%
Property and equipment, before depreciation$4.9B11 Dec 27, 2025$4.0B11 Dec 28, 2024+24.0%
Accumulated depreciation$2.6B11 Dec 27, 2025$2.2B11 Dec 28, 2024+20.4%
Property and equipment, net$2.3B11 Dec 27, 2025$1.8B11 Dec 28, 2024+28.3%
Operating-lease assets (leased space)$623.0M15 Dec 28, 2024$633.0M15 Dec 30, 2023−1.6%

Investments

ItemLatestA year beforeChange
Cash and cash equivalents$5.5B11 Dec 27, 2025$3.8B11 Dec 28, 2024+46.3%
Marketable securities, current$5.0B11 Dec 27, 2025$1.3B11 Dec 28, 2024+272.7%
Debt securities available for sale$9.4B11 Dec 27, 2025$4.0B11 Dec 28, 2024+134.2%
Stakes in other companies (equity method)$149.0M15 Dec 28, 2024$99.0M15 Dec 30, 2023+50.5%

Intangibles and goodwill

ItemLatestA year beforeChange
Goodwill$25.1B11 Dec 27, 2025$24.8B11 Dec 28, 2024+1.2%
Intangible assets, net (excluding goodwill)$16.7B11 Dec 27, 2025$18.9B11 Dec 28, 2024−11.8%
Finite-lived intangibles, gross$26.8B11 Dec 27, 2025$26.6B11 Dec 28, 2024+0.7%
Accumulated amortization$10.1B11 Dec 27, 2025$7.9B11 Dec 28, 2024+28.6%
Finite-lived intangibles, net$16.7B11 Dec 27, 2025$18.8B11 Dec 28, 2024−11.0%

Inventory

ItemLatestA year beforeChange
Inventory, total$7.9B11 Dec 27, 2025$5.7B11 Dec 28, 2024+38.1%
Raw materials$909.0M11 Dec 27, 2025$351.0M11 Dec 28, 2024+159.0%
Work in process$4.8B11 Dec 27, 2025$4.3B11 Dec 28, 2024+11.2%
Finished goods$2.2B11 Dec 27, 2025$1.1B11 Dec 28, 2024+105.0%

Properties, in its own words

As of December 27, 2025, we have approximately 6.8 million square feet of space for research and development, engineering, administrative and warehouse use throughout the world. These facilities include approximately 5.4 million square feet of leased space and approximately 1.4 million square feet of owned space. Our headquarters are located in Santa Clara, California, and we have significant operations in Austin, Texas; San Jose, California; Shanghai, China; Markham, Ontario, Canada; Longmont, Colorado; Dublin, Ireland; Singapore; and Bengaluru and Hyderabad, India. We also have a number of regional sales offices located in commercial centers near customers, principally in the United States, Europe, Asia and Latin America.

We currently do not anticipate difficulty in either retaining occupancy of any of our facilities through lease renewals prior to expiration or through month-to-month occupancy or replacing them with equivalent facilities. We believe that our existing facilities are suitable and adequate for our present purposes and that the productive capacity of such facilities is substantially being utilized or we have plans to utilize such capacity.

Item 2 of the 10-K filed Feb 4, 2026.20

Stakes and holdings (Wikidata)

Things Wikidata records the company as owning, with the share when stated.1

The story

Founded by Edwin Turney, Jack Gifford and Jerry Sanders on May 1, 1969, in Sunnyvale.1

Foundational years

Advanced Micro Devices was formally incorporated by Jerry Sanders, along with seven of his colleagues from Fairchild Semiconductor—Ed Turney; John Carey; Sven Simonsen; Jack Gifford, and three members of his team: Frank Botte, Jim Giles, and Larry Stenger, on May 1, 1969. Sanders, an electrical engineer who was the director of marketing at Fairchild, had, like many of its executives, grown frustrated with the increasing lack of support, opportunity, and flexibility within the company. He later decided to leave to start his own semiconductor company, following the footsteps of Robert Noyce (developer of the first silicon integrated circuit at Fairchild in 1959) and Gordon Moore, who together founded the semiconductor company Intel in July 1968.

In September 1969, AMD moved from its temporary location in Santa Clara to its new $500,000 15,000sqft headquarters at 901 Thompson Place, Sunnyvale, which housed the entire company, including the 8-mask, 7 μm feature size, 2-inch diameter wafer production. To immediately secure a customer base, AMD initially became a second source supplier of microchips designed by Fairchild (the 5 V TTL "9300" logic series) and National Semiconductor. AMD first focused on producing logic chips. The company guaranteed quality control to United States Military Standard, an advantage in the early computer industry since unreliability in microchips was a distinct problem that customers – including computer manufacturers, the telecommunications industry, and instrument manufacturers – wanted to avoid.

In November 1969, the company manufactured its first product: the Am9300, a 4-bit MSI shift register, which began selling in 1970. Also in 1970, AMD produced its first proprietary product, the Am2501 logic counter, which was highly successful. Its bestselling product in 1971 was the Am2505, the fastest multiplier available.

In 1971, AMD entered the RAM chip market, beginning with the Am3101, a 64-bit bipolar RAM. That year AMD also greatly increased the sales volume of its linear integrated circuits, and by year-end the company's total annual sales reached US$4.6 million.

AMD went public in September 1972. The company was a second source for Intel MOS/LSI circuits by 1973, with products such as Am14/1506 and Am14/1507, dual 100-bit dynamic shift registers. By 1975, AMD was producing 212 products – of which 49 were proprietary, including the Am9102 (a static N-channel 1024-bit RAM) and three low-power Schottky MSI circuits: Am25LS07, Am25LS08, and Am25LS09.

Intel had created the first microprocessor, its 4-bit 4004, in 1971. By 1975, AMD entered the microprocessor market with the Am9080, a reverse-engineered clone of the Intel 8080, and the Am2900 bit-slice microprocessor family. When Intel began installing microcode in its microprocessors in 1976, it entered into a cross-licensing agreement with AMD, which was granted a copyright license to the microcode in its microprocessors and peripherals, effective October 1976.

In 1977, AMD entered into a joint venture with Siemens, a German engineering conglomerate wishing to enhance its technology expertise and enter the American market. Siemens purchased 20% of AMD's stock, giving the company an infusion of cash to increase its product lines. The two companies also jointly established Advanced Micro Computers (AMC), located in Silicon Valley and in Germany, allowing AMD to enter the microcomputer development and manufacturing field, in particular based on AMD's second-source Zilog Z8000 microprocessors. When the two companies' vision for Advanced Micro Computers diverged, AMD bought out Siemens' stake in the American division in 1979. AMD closed Advanced Micro Computers in late 1981 after switching focus to manufacturing second-source Intel x86 microprocessors.

Total sales in fiscal year 1978 topped $100 million, and in 1979, AMD debuted on the New York Stock Exchange. In 1979, production also began on AMD's new semiconductor fabrication plant in Austin, Texas; the company already had overseas assembly facilities in Penang and Manila, and began construction on a fabrication plant in San Antonio in 1981. In 1980, AMD began supplying semiconductor products for telecommunications, an industry undergoing rapid expansion and innovation.

Read the full text

Intel partnership

Intel had introduced the first x86 microprocessors in 1978. In 1981, IBM created its personal computer, and wanted Intel's x86 processors, but only under the condition that Intel would also provide a second-source manufacturer for its patented x86 microprocessors. Intel and AMD entered into a 10-year technology exchange agreement, first signed in October 1981 and formally executed in February 1982. The terms of the agreement were that each company could acquire the right to become a second-source manufacturer of semiconductor products developed by the other; that is, each party could "earn" the right to manufacture and sell a product developed by the other, if agreed to, by exchanging the manufacturing rights to a product of equivalent technical complexity. The technical information and licenses needed to make and sell a part would be exchanged for a royalty to the developing company. The 1982 agreement also extended the 1976 AMD–Intel cross-licensing agreement through 1995. The agreement included the right to invoke arbitration of disagreements, and after five years the right of either party to end the agreement with one year's notice. The main result of the 1982 agreement was that AMD became a second-source manufacturer of Intel's x86 microprocessors and related chips, and Intel provided AMD with database tapes for its 8086, 80186, and 80286 chips. However, in the event of a bankruptcy or takeover of AMD, the cross-licensing agreement would be effectively canceled.

Beginning in 1982, AMD began volume-producing second-source Intel-licensed 8086, 8088, 80186, and 80188 processors, and by 1984, its own Am286 clone of Intel's 80286 processor, for the rapidly growing market of IBM PCs and IBM clones. It also continued its successful concentration on proprietary bipolar chips.

The company continued to spend greatly on research and development, and created the world's first 512K EPROM in 1984. That year, AMD was listed in the book The 100 Best Companies to Work for in America, and later made the Fortune 500 list for the first time in 1985.

By mid-1985, the microchip market experienced a severe downturn, mainly due to long-term aggressive trade practices (dumping) from Japan, but also due to a crowded and non-innovative chip market in the United States. AMD rode out the mid-1980s crisis by aggressively innovating and modernizing, devising the Liberty Chip program of designing and manufacturing one new chip or chipset per week for 52 weeks in fiscal year 1986, and by heavily lobbying the U.S. government until sanctions and restrictions were put in place to prevent predatory Japanese pricing. During this time, AMD withdrew from the DRAM market, and made some headway into the CMOS market, which it had lagged in entering, having focused instead on bipolar chips.

AMD had some success in the mid-1980s with the AMD7910 and AMD7911 "World Chip" FSK modem, one of the first multi-standard devices that covered both Bell and CCITT tones at up to 1200 baud half duplex or 300/300 full duplex. Beginning in 1986, AMD embraced the perceived shift toward RISC with its own AMD Am29000 (29k) processor; the 29k survived as an embedded processor. The company also increased its EPROM memory market share in the late 1980s. Throughout the 1980s, AMD was a second-source supplier of Intel x86 processors. In 1991, it introduced its 386-compatible Am386, an AMD-designed chip. Creating its own chips, AMD began to compete directly with Intel.

In January 1996, AMD acquired NexGen for $857 million to develop what eventually became AMD K6. At the time, NexGen was working on its Nx686 microprocessor.

AMD had a large, successful flash memory business, even during the dotcom bust. In 2003, to divest some manufacturing and aid its overall cash flow, which was under duress from aggressive microprocessor competition from Intel, AMD spun off its flash memory business and manufacturing into Spansion, a joint venture with Fujitsu, which had been co-manufacturing flash memory with AMD since 1993. In December 2005, AMD divested itself of Spansion to focus on the microprocessor market, and Spansion went public in an IPO.

2006–2019

On July 24, 2006, AMD announced its acquisition of the Canadian 3D graphics card company ATI Technologies. AMD paid $4.3 billion and 58 million shares of its stock, for approximately $5.4 billion. The transaction was completed on October 25, 2006. On August 30, 2010, AMD announced that it would retire the ATI brand name for its graphics chipsets in favor of the AMD brand name.

In October 2008, AMD announced plans to spin off manufacturing operations in the form of GlobalFoundries Inc., a multibillion-dollar joint venture with Advanced Technology Investment Co., an investment company formed by the government of Abu Dhabi. The partnership and spin-off gave AMD an infusion of cash and allowed it to focus solely on chip design. To assure the Abu Dhabi investors of the new venture's success, AMD's CEO Hector Ruiz stepped down in July 2008, while remaining executive chairman, in preparation for becoming chairman of GlobalFoundries in March 2009. President and COO Dirk Meyer became AMD's CEO. Recessionary losses necessitated AMD cutting 1,100 jobs in 2009.

In August 2011, AMD announced that former Lenovo executive Rory Read would be joining the company as CEO, replacing Meyer. In November 2011, AMD announced plans to lay off more than 10% (1,400) of its employees from across all divisions worldwide. In October 2012, it announced plans to lay off an additional 15% of its workforce to reduce costs in the face of declining sales revenue. The inclusion of AMD chips into the PlayStation 4 and Xbox One were later seen as saving AMD from bankruptcy.

AMD acquired the low-power server manufacturer SeaMicro in early 2012, with an eye to bringing out an Arm64 server chip.

On October 8, 2014, AMD announced that Rory Read had stepped down after three years as president and chief executive officer. He was succeeded by Lisa Su, a key lieutenant who had been chief operating officer since June.

On October 16, 2014, AMD announced a new restructuring plan along with its Q3 results. Effective July 1, 2014, AMD reorganized into two business groups: Computing and Graphics, which primarily includes desktop and notebook processors and chipsets, discrete GPUs, and professional graphics; and Enterprise, Embedded, and Semi-Custom, which primarily includes server and embedded processors, dense servers, semi-custom SoC products (including solutions for gaming consoles), engineering services, and royalties. As part of this restructuring, AMD announced that 7% of its global workforce would be laid off by the end of 2014.

After the GlobalFoundries spin-off and subsequent layoffs, AMD was left with significant vacant space at 1 AMD Place, its aging Sunnyvale headquarters office complex. In August 2016, AMD's 47 years in Sunnyvale came to a close when it signed a lease with the Irvine Company for a new 220,000 sq. ft. headquarters building in Santa Clara. AMD's new location at Santa Clara Square faces the headquarters of arch-rival Intel across the Bayshore Freeway and San Tomas Aquino Creek. Around the same time, AMD also agreed to sell 1 AMD Place to the Irvine Company. In April 2019, the Irvine Company secured approval from the Sunnyvale City Council of its plans to demolish 1 AMD Place and redevelop the entire 32-acre site into townhomes and apartments.

2020–present

In October 2020, AMD announced that it was acquiring Xilinx, the market leader in field-programmable gate arrays and complex programmable logic devices (FPGAs and CPLDs) in an all-stock transaction. The acquisition was completed in February 2022, with an estimated acquisition price of $50 billion.

In January 2024, AMD announced it was discontinuing the production of all complex programmable logic devices (CPLDs) acquired through Xilinx.

In March 2024, a rally in semiconductor stocks pushed AMD's valuation above $300B for the first time.

In July 2024, AMD announced that it would acquire the Finnish-based artificial intelligence start-up company Silo AI in a $665 million all-cash deal in an attempt to better compete with AI chip market leader Nvidia.

In August 2024, AMD signed a deal to acquire ZT Systems for $4.9 billion. The company creates custom computing infrastructure that is used for AI tasks.

Since early 2024, AMD has made significant gains in the server CPU market, reducing the gap with Intel. Initial reports of a 50:50 market split drew on incorrect data and were later revised. As of July 2025, Intel holds 63.3% of the server CPU market, while AMD has reached 36.5%, showing a strong upward trend for AMD despite Intel's continuing lead.

In June 2025, AMD unveiled the AI server for 2026, the MI400 series of chips, which will be the basis of a new server called "Helios".

In October 2025, the company announced it had agreed a deal with OpenAI to sell six gigawatts of its AI processors over the next five years. As part of the deal, OpenAI has the option to acquire a 10 per cent stake in AMD: 160 million shares at a token price of $0.01 per share contingent on meeting undisclosed performance targets, the final tranche of options requiring AMD common stock to reach $600 per share.

On September 28, 2026, AMD announced an agreement to acquire World Labs, an artificial intelligence startup specializing in 3D spatial intelligence and world models, in an all-stock transaction valued at approximately $8.2 billion. As part of the transaction, World Labs co-founder Dr. Fei-Fei Li agreed to join AMD as Executive Vice President and Chief Scientist, reporting directly to CEO Lisa Su.

From Wikipedia’s article on AMD, shared under CC BY-SA 4.0.8

Leadership

Who has led AMD, and when. Pick a name to see everywhere that person has worked.

Board members and other officers (65)

Products and brands

  • AMD microprocessor
  • chipset
  • computer hardware
  • frame grabber
  • graphics processing unit
  • microprocessor

Listed on Wikidata.1

Products

IBM PC and the x86 architecture

In February 1982, AMD signed a contract with Intel, becoming a licensed second-source manufacturer of 8086 and 8088 processors. IBM wanted to use the Intel 8088 in its IBM PC, but its policy at the time was to require at least two sources for its chips (→ Second source). AMD later produced the Am286 under the same arrangement. In 1984, Intel internally decided to no longer cooperate with AMD in supplying product information to shore up its advantage in the marketplace, and delayed and eventually refused to convey the technical details of the Intel 80386. In 1987, AMD invoked arbitration over the issue, and Intel reacted by canceling the 1982 technological-exchange agreement altogether. After three years of testimony, AMD eventually won in arbitration in 1992, but Intel disputed this decision. Another long legal dispute followed, ending in 1994 when the Supreme Court of California sided with the arbitrator and AMD.

In 1990, Intel countersued AMD, renegotiating AMD's right to use derivatives of Intel's microcode for its cloned processors. In the face of uncertainty during the legal dispute, AMD was forced to develop clean room designed versions of Intel code for its x386 and x486 processors, the former long after Intel had released its own x386 in 1985. In March 1991, AMD released the Am386, its clone of the Intel 386 processor. By October of the same year it had sold one million units.

In 1993, AMD introduced the first of the Am486 family of processors, which proved popular with a large number of original equipment manufacturers, including Compaq, which signed an exclusive agreement using the Am486. The Am5x86, another Am486-based processor, was released in November 1995, and continued AMD's success as a fast, cost-effective processor.

Finally, in an agreement effective 1996, AMD received the rights to the microcode in Intel's x386 and x486 processor families, but not the rights to the microcode in the following generations of processors.

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K5, K6, Athlon, Duron, and Sempron

AMD's first in-house x86 processor was the K5, launched in 1996. The "K" in its name was a reference to Kryptonite, the only substance known to harm comic book character Superman. This itself was a reference to Intel's hegemony over the market, i.e., an anthropomorphization of them as Superman. The number "5" was a reference to the fifth generation of x86 processors; rival Intel had previously introduced its line of fifth-generation x86 processors as Pentium because the U.S. Trademark and Patent Office had ruled that mere numbers could not be trademarked.

In 1996, AMD purchased NexGen, specifically for the rights to its Nx series of x86-compatible processors. AMD gave the NexGen design team their own building, left them alone, and gave them time and money to rework the Nx686. The result was the K6 processor, introduced in 1997. Although it was based on Socket 7, variants such as K6-III/450 were faster than Intel's Pentium II (sixth-generation processor).

The K7 was AMD's seventh-generation x86 processor, making its debut under the brand name Athlon on June 23, 1999. Unlike previous AMD processors, it could not be used on the same motherboards as Intel's, due to licensing issues surrounding Intel's Slot 1 connector, and instead used a Slot A connector, referenced to the Alpha processor bus. The Duron was a lower-cost and limited version of the Athlon (64 KB instead of 256 KB L2 cache) in a 462-pin socketed PGA (socket A) or soldered directly onto the motherboard. Sempron was released as a lower-cost Athlon XP, replacing Duron in the socket A PGA era. It has since been migrated upward to all new sockets, up to AM3.

On October 9, 2001, the Athlon XP was released. On February 10, 2003, the Athlon XP with 512 KB L2 Cache was released.

Athlon 64, Opteron, and Phenom

The K8 was a major revision of the K7 architecture, with the most notable features being the addition of a 64-bit extension to the x86 instruction set (called x86-64, AMD64, or x64), the incorporation of an on-chip memory controller, and the implementation of an extremely high-performance point-to-point interconnect called HyperTransport, as part of the Direct Connect Architecture. The technology was initially launched as the Opteron server-oriented processor on April 22, 2003. Shortly thereafter, it was incorporated into a product for desktop PCs, branded Athlon 64.

On April 21, 2005, AMD released the first dual-core Opteron, an x86-based server CPU. A month later, it released the Athlon 64 X2, the first desktop-based dual-core processor family. In May 2007, AMD abandoned the string "64" in its dual-core desktop product branding, becoming Athlon X2, downplaying the significance of 64-bit computing in its processors. Further updates involved improvements to the microarchitecture, and a shift of the target market from mainstream desktop systems to value dual-core desktop systems. In 2008, AMD started to release dual-core Sempron processors exclusively in China, branded as the Sempron 2000 series, with lower HyperTransport speed and smaller L2 cache. AMD completed its dual-core product portfolio for each market segment.

In September 2007, AMD released the first server Opteron K10 processors, followed in November by the Phenom processor for desktop. K10 processors came in dual-core, triple-core, and quad-core versions, with all cores on a single die. AMD released a new platform codenamed "Spider", which used the new Phenom processor, and an R770 GPU and a 790 GX/FX chipset from the AMD 700 chipset series. However, AMD built the Spider at 65nm, which was uncompetitive with Intel's smaller and more power-efficient 45nm.

In January 2009, AMD released a new processor line dubbed Phenom II, a refresh of the original Phenom built using the 45 nm process. AMD's new platform, codenamed "Dragon", used the new Phenom II processor, and an ATI R770 GPU from the R700 GPU family, and a 790 GX/FX chipset from the AMD 700 chipset series. The Phenom II came in dual-core, triple-core and quad-core variants, all using the same die, with cores disabled for the triple-core and dual-core versions. The Phenom II resolved issues that the original Phenom had, including a low clock speed, a small L3 cache, and a Cool'n'Quiet bug that decreased performance. The Phenom II cost less but was not performance-competitive with Intel's mid-to-high-range Core 2 Quads. The Phenom II also enhanced its predecessor's memory controller, allowing it to use DDR3 in a new native socket AM3, while maintaining backward compatibility with AM2+, the socket used for the Phenom, and allowing the use of the DDR2 memory that was used with the platform.

In April 2010, AMD released a new Phenom II Hexa-core (6-core) processor codenamed "Thuban". This was a totally new die based on the hexa-core "Istanbul" Opteron processor. It included AMD's "turbo core" technology, which allows the processor to automatically switch from 6 cores to 3 faster cores when more pure speed is needed.

The Magny Cours and Lisbon server parts were released in 2010. The Magny Cours part came in 8 to 12 cores and the Lisbon part in 4 and 6 core parts. Magny Cours is focused on performance while the Lisbon part is focused on high performance per watt. Magny Cours is an MCM (multi-chip module) with two hexa-core "Istanbul" Opteron parts. This will use a new socket G34 for dual and quad-socket processors and thus will be marketed as Opteron 61xx series processors. Lisbon uses socket C32 certified for dual-socket use or single socket use only and thus will be marketed as Opteron 41xx processors. Both will be built on a 45 nm SOI process.

Fusion becomes the AMD APU

Following AMD's 2006 acquisition of Canadian graphics company ATI Technologies, an initiative codenamed Fusion was announced to integrate a CPU and GPU together on some of AMD's microprocessors, including a built in PCI Express link to accommodate separate PCI Express peripherals, eliminating the northbridge chip from the motherboard. The initiative intended to move some of the processing originally done on the CPU (e.g. floating-point unit operations) to the GPU, which is better optimized for some calculations. The Fusion was later renamed the AMD APU (Accelerated Processing Unit).

Llano was AMD's first APU built for laptops. Llano was the second APU released, targeted at the mainstream market. It incorporated a CPU and GPU on the same die, and northbridge functions, and used "Socket FM1" with DDR3 memory. The CPU part of the processor was based on the Phenom II "Deneb" processor. AMD suffered an unexpected decrease in revenue based on production problems for the Llano. More AMD APUs for laptops running Windows 7 and Windows 8 OS are being used commonly. These include AMD's price-point APUs, the E1 and E2, and their mainstream competitors with Intel's Core i-series: The Vision A- series, the A standing for accelerated. These range from the lower-performance A4 chipset to the A6, A8, and A10. These all incorporate next-generation Radeon graphics cards, with the A4 utilizing the base Radeon HD chip and the rest using a Radeon R4 graphics card, with the exception of the highest-model A10 (A10-7300) which uses an R6 graphics card.

High-power, high-performance Bulldozer cores

Bulldozer was AMD's microarchitecture codename for server and desktop AMD FX processors, first released on October 12, 2011. This family 15h microarchitecture is the successor to the family 10h (K10) microarchitecture design. Bulldozer was a clean-sheet design, not a development of earlier processors. The core was specifically aimed at 10–125 W TDP computing products. AMD claimed dramatic performance-per-watt efficiency improvements in high-performance computing (HPC) applications with Bulldozer cores. While hopes were high that Bulldozer would bring AMD to be performance-competitive with Intel once more, most benchmarks were disappointing. In some cases the new Bulldozer products were slower than the K10 models they were built to replace.

The Piledriver microarchitecture was the 2012 successor to Bulldozer, increasing clock speeds and performance relative to its predecessor. Piledriver would be released in AMD FX, APU, and Opteron product lines. Piledriver was subsequently followed by the Steamroller microarchitecture in 2013. Used exclusively in AMD's APUs, Steamroller focused on greater parallelism.

In 2015, the Excavator microarchitecture replaced Piledriver. Expected to be the last microarchitecture of the Bulldozer series, Excavator focused on improved power efficiency.

Low-power Cat cores

The Bobcat microarchitecture was revealed during a speech from Henri Richard, AMD executive vice-president, in Computex 2007, and was put into production during the first quarter of 2011. Based on the difficulty competing in the x86 market with a single core optimized for the 10–100 W range, AMD had developed a simpler core with a target range of 1–10 watts. In addition, it was believed that the core could migrate into the hand-held space if the power consumption can be reduced to less than 1 W.

Jaguar is a microarchitecture codename for Bobcat's successor, released in 2013, that is used in various APUs from AMD aimed at the low-power/low-cost market. Jaguar and its derivates would go on to be used in the custom APUs of the PlayStation 4, Xbox One, PlayStation 4 Pro, Xbox One S, and Xbox One X. Jaguar would be later followed by the Puma microarchitecture in 2014.

ARM architecture-based designs

In 2012, AMD announced it was working on ARM products, both as a semi-custom product and server product. The initial server product was announced as the Opteron A1100 in 2014, an 8-core Cortex-A57-based ARMv8-A SoC, and was expected to be followed by an APU incorporating a Graphics Core Next GPU. However, the Opteron A1100 was not released until 2016, with the delay attributed to adding software support. The A1100 was also criticized for not having support from major vendors upon its release.

In 2014, AMD also announced the K12 custom core for release in 2016. While being ARMv8-A instruction set architecture compliant, the K12 was expected to be entirely custom-designed, targeting the server, embedded, and semi-custom markets. While ARM architecture development continued, products based on K12 were subsequently delayed with no release planned. Development of AMD's x86-based Zen microarchitecture was preferred.

Zen-based CPUs and APUs

Zen is an architecture for x86-64 based Ryzen series of CPUs and APUs, introduced in 2017 by AMD and built from the ground up by a team led by Jim Keller, beginning with his arrival in 2012, and taping out before his departure in September 2015.

One of AMD's primary goals with Zen was an IPC increase of at least 40%, however in February 2017 AMD announced that it had actually achieved a 52% increase. Processors made on the Zen architecture are built on the 14 nm FinFET node and have a renewed focus on single-core performance and HSA compatibility. Previous processors from AMD were either built in the 32 nm process ("Bulldozer" and "Piledriver" CPUs) or the 28 nm process ("Steamroller" and "Excavator" APUs). Because of this, Zen is much more energy efficient.

The Zen architecture is the first to encompass CPUs and APUs from AMD built for a single socket (Socket AM4). Also new for this architecture is the implementation of simultaneous multithreading (SMT) technology, something Intel has had for years on some of its processors with its proprietary hyper-threading implementation of SMT. This is a departure from the "Clustered MultiThreading" design introduced with the Bulldozer architecture. Zen also has support for DDR4 memory.

AMD released the Zen-based high-end Ryzen 7 "Summit Ridge" series CPUs on March 2, 2017, mid-range Ryzen 5 series CPUs on April 11, 2017, and entry level Ryzen 3 series CPUs on July 27, 2017. AMD later released the Epyc line of Zen derived server processors for 1P and 2P systems. In October 2017, AMD released Zen-based APUs as Ryzen Mobile, incorporating Vega graphics cores. In January 2018, AMD announced its new lineup plans, with Ryzen 2. AMD launched CPUs with the 12nm Zen+ microarchitecture in April 2018, following up with the 7nm Zen 2 microarchitecture in June 2019, including an update to the Epyc line with new processors using the Zen 2 microarchitecture in August 2019, and Zen 3 slated for release in Q3 2020.

As of 2019, AMD's Ryzen processors were reported to outsell Intel's consumer desktop processors. At CES 2020 AMD announced its Ryzen Mobile 4000, as the first 7 nm x86 mobile processor, the first 7 nm 8-core (also 16-thread) high-performance mobile processor, and the first 8-core (also 16-thread) processor for ultrathin laptops. This generation is still based on the Zen 2 architecture. In October 2020, AMD announced new processors based on the Zen 3 architecture. On PassMark's Single thread performance test the Ryzen 5 5600x bested all other CPUs besides the Ryzen 9 5950X.

In April 2020, AMD launched three new SKUs which target commercial HPC workloads & hyperconverged infrastructure applications. The launch was based on Epyc's 7 nm second-generation Rome platform and supported by Dell EMC, Hewlett Packard Enterprise, Lenovo, Supermicro, and Nutanix. IBM Cloud was its first public cloud partner. In August 2022, AMD announced its initial lineup of CPUs based on the new Zen 4 architecture.

The Steam Deck, PlayStation 5, Xbox Series X and Series S all use chips based on the Zen 2 microarchitecture, with proprietary tweaks and different configurations in each system's implementation than AMD sells in its own commercially available APUs.

ATI prior to AMD acquisition

Lee Ka Lau, Francis Lau, Benny Lau, and Kwok Yuen Ho founded ATI in 1985 as Array Technology Incorporated, renamed later Array Technologies Incorporated and finally ATI Technologies.

Working primarily in the OEM field, ATI produced integrated graphics cards for PC manufacturers such as IBM and Commodore. By 1987, ATI had grown into an independent graphics-card retailer, introducing EGA Wonder and VGA Wonder card product lines that year. In the early nineties, they released products able to process graphics without the CPU: in May 1991, the Mach8, in 1992 the Mach32, which offered improved memory bandwidth and GUI acceleration. ATI Technologies went public in 1993, with shares listed on NASDAQ and on the Toronto Stock Exchange.

In 1994, the Mach64 accelerator debuted, powering the Graphics Xpression and Graphics Pro Turbo, offering hardware support for YUV-to-RGB colour space conversion in addition to hardware zoom; early techniques of hardware-based video acceleration.

ATI introduced its first combination of 2D and 3D accelerator under the name 3D Rage. This chip was based on the Mach 64, but it featured elemental 3D acceleration. The ATI Rage line powered almost the entire range of ATI graphics products. In particular, the Rage Pro was one of the first viable 2D-plus-3D alternatives to 3dfx's 3D-only Voodoo chipset. 3D acceleration in the Rage line advanced from the basic functionality within the initial 3D Rage to a more advanced DirectX 6.0 accelerator in 1999 Rage 128.

The All-in-Wonder product line, introduced in 1996, was the first combination of integrated graphics chip with TV tuner card and the first chip that enabled display of computer graphics on a TV set. The cards featured 3D acceleration powered by ATI's 3D Rage II, 64-bit 2D performance, TV-quality video acceleration, analogue video capture, TV tuner functionality, flicker-free TV-out and stereo TV audio reception.

ATI entered the mobile computing sector by introducing 3D-graphics acceleration to laptops in 1996. The Mobility product line had to meet requirements different from those of desktop PCs, such as minimized power usage, reduced heat output, TMDS output capabilities for laptop screens, and maximized integration. In 1997, ATI acquired Tseng Labs's graphics assets, which included 40 engineers.

The Radeon line of graphics products was unveiled in 2000. The initial Radeon GPU offered an all-new design with DirectX 7.0 3D acceleration, video acceleration, and 2D acceleration. Technology developed for a specific Radeon generation could be built in varying levels of features and performance in order to provide products suited for the entire market range, from high-end to budget to mobile versions.

In 2000, ATI acquired ArtX, which engineered the Flipper graphics chip used in the GameCube video game console. They also created a modified version of the chip (codenamed Hollywood) for the successor of the GameCube, the Wii. Microsoft contracted ATI to design the graphics core (codenamed Xenos) for the Xbox 360. Later in 2005, ATI acquired Terayon's cable modem silicon intellectual property, strengthening their lead in the consumer digital television market. K. Y. Ho remained as chairman of the board until he retired in November 2005. Dave Orton replaced him as the president and CEO of the organization.

On July 24, 2006, a joint announcement revealed that AMD would acquire ATI in a deal valued at $5.6 billion. The acquisition consideration closed on October 25, 2006, and included over $2 billion financed from a loan and 56 million shares of AMD stock. ATI's operations became part of the AMD Graphics Product Group (GPG), and ATI's CEO Dave Orton became the executive vice president of Visual and Media Businesses at AMD until his resignation in 2007. The top-level management was reorganized with the senior vice president and general manager, and the senior vice president and general manager of Consumer Electronics Group, both of whom would report to the CEO of AMD. On August 30, 2010, John Trikola announced that AMD would retire the ATI brand for its graphics chipsets in favour of the AMD name.

Technologies

CPU hardware

As of 2017 technologies found in AMD CPU/APU and other products include:

HyperTransport – a high-bandwidth, low-latency system bus used in AMD's CPU and APU products

Infinity Fabric – a derivative of HyperTransport used as the communication bus in AMD's Zen microarchitecture

Graphics hardware

As of 2017 technologies found in AMD GPU products include:

AMD Eyefinity – facilitates multi-monitor setup of up to 6 monitors per graphics card

AMD FreeSync – display synchronization based on the VESA Adaptive Sync standard

AMD TrueAudio – acceleration of audio calculations

AMD XConnect – allows the use of External GPU enclosures through Thunderbolt 3

AMD CrossFire – multi-GPU technology allowing the simultaneous use of multiple GPUs

Unified Video Decoder (UVD) – acceleration of video decompression (decoding)

Video Coding Engine (VCE) – acceleration of video compression (encoding)

Software

AMD has taken actions towards opening its software tools above the firmware level in the past decade.

Software not explicitly stated as being free can be assumed to be proprietary.

Distribution

AMD Radeon Software is the default channel for official software distribution from AMD. It includes both free and proprietary software components, and supports both Microsoft Windows and Linux.

CPU

AOCC is AMD's optimizing proprietary C/C++ compiler based on LLVM and available for Linux.

AMDuProf is AMD's CPU performance and Power profiling tool suite, available for Linux and Windows.

AMD has also taken an active part in developing coreboot, an open-source project aimed at replacing the proprietary BIOS firmware. This cooperation ceased in 2013, but AMD has indicated recently that it is considering releasing source code so that Ryzen can be compatible with coreboot in the future.

GPU

Most notable public AMD software is on the GPU side.

AMD has opened both its graphic and compute stacks:

GPUOpen is AMD's graphics stack, which includes for example FidelityFX Super Resolution.

ROCm (Radeon Open Compute platform) is AMD's compute stack for machine learning and high-performance computing, based on the LLVM compiler technologies. Under the ROCm project, AMDgpu is AMD's open-source device driver supporting the GCN and following architectures, available for Linux. This latter driver component is used both by the graphics and compute stacks.

Other

AMD conducts open research on heterogeneous computing.

Other AMD software includes the AMD Core Math Library, and open-source software including the AMD Performance Library.

AMD contributes to open-source projects, including working with Sun Microsystems to enhance OpenSolaris and Sun xVM on the AMD platform. AMD also maintains its own Open64 compiler distribution and contributes its changes back to the community.

In 2008, AMD released the low-level programming specifications for its GPUs, and works with the X.Org Foundation to develop drivers for AMD graphics cards.

Extensions for software parallelism (xSP), aimed at speeding up programs to enable multi-threaded and multi-core processing, announced in Technology Analyst Day 2007. One of the initiatives being discussed since August 2007 is the Light Weight Profiling (LWP), providing internal hardware monitor with runtimes, to observe information about executing process and help the re-design of software to be optimized with multi-core and even multi-threaded programs. Another one is the extension of Streaming SIMD Extension (SSE) instruction set, the SSE5.

Codenamed SIMFIRE – interoperability testing tool for the Desktop and mobile Architecture for System Hardware (DASH) open architecture.

In March 2025 AMD announced Instella an open source large language model.

AMD Chipset Software, the drivers and software package for AMD CPUs and southbridge chipsets.

From Wikipedia’s article on AMD, shared under CC BY-SA 4.0.8

Subsidiaries and ownership

Owners

Subsidiaries

Also owns

Subsidiaries (Exhibit 21)

  • AMD (EMEA) LTD. Delaware9
  • AMD Advanced Micro Devices (ROU) S.R.L. Romania9
  • AMD Advanced Research, LLC Delaware9
  • AMD Design, LLC Delaware9
  • AMD Far East Ltd. Delaware9
  • AMD Federal Technologies, LLC Delaware9
  • AMD India Private Limited India9
  • AMD International Sales & Service, Ltd. Delaware9
  • AMD Japan Ltd. Japan9
  • AMD Latin America Ltd. Delaware9
  • AMD Research Technologies, Inc. Delaware9
  • AMD South America Ltda. Brazil9
  • ATI International SRL (*) (3)(**) Barbados9
  • ATI Technologies (Bermuda) Limited Bermuda9
  • ATI Technologies (L) Inc. Malaysia9
  • ATI Technologies ULC Canada9
  • Advanced Micro Devices (China) Co., Ltd. China9
  • Advanced Micro Devices (Poland) sp. z o.o. Poland9
  • Advanced Micro Devices (Shanghai) Co., Ltd. China9
  • Advanced Micro Devices (Singapore) Pte. Ltd. Singapore9
  • Advanced Micro Devices (Spain), S.L. Spain9
  • Advanced Micro Devices (U.K.) Limited United Kingdom9
  • Advanced Micro Devices AB Sweden9
  • Advanced Micro Devices Belgium N.V. Belgium9
All 90 listed subsidiaries
  • Advanced Micro Devices CH GmbH Switzerland9
  • Advanced Micro Devices Global Services (M) Sdn. Bhd. Malaysia9
  • Advanced Micro Devices GmbH Germany9
  • Advanced Micro Devices Malaysia Ltd. Malaysia9
  • Advanced Micro Devices Products (China) Co., Ltd. China9
  • Advanced Micro Devices RS d.o.o. Serbia9
  • Advanced Micro Devices S.A.S. France9
  • Advanced Micro Devices S.p.A. Italy9
  • Advanced Micro Devices Sdn. Bhd. Malaysia9
  • Brium Inc. Europe France9
  • Brium Switzerland GmbH Switzerland9
  • Brium, Inc. Delaware9
  • Chengdu Haiguang Integrated Circuit Design Co., Ltd. China9
  • Chengdu Haiguang Microelectronics Technology Co., Ltd. China9
  • Combient Mix AB Sweden9
  • Enosemi, Inc. Delaware9
  • Lapland NewCo LLC Delaware9
  • Level 5 Networks, Inc. Delaware9
  • MK One Technologies, Inc. Delaware9
  • Machine2Learn B.V. Netherlands9
  • Mipsology S.A.S. France9
  • Mipsology, Inc. Delaware9
  • Pensando Systems, Inc. Delaware9
  • Prakhyaat VDCSE Private Limited India9
  • Silexica GmbH Germany9
  • Silexica, Inc. Delaware9
  • Silo AI Denmark Aps Denmark9
  • Silo AI Oy Finland9
  • Silo AI Sweden AB Sweden9
  • Silo GenAI Oy Finland9
  • Solarflare Communications, Inc. Delaware9
  • Solarflare India Private Limited (25) (*) India9
  • Suzhou TF-AMD Semiconductor Co., Ltd. China9
  • TF AMD Micro Electronics (Penang) Sdn. Bhd. Malaysia9
  • Variscale Services & Engineering Australia Pty Limited Australia9
  • Variscale Services & Engineering HK Limited Hong Kong SAR, China9
  • Variscale Services & Engineering Japan G.K. (30) (**) Japan9
  • Variscale Services & Engineering Malaysia Sdn. Bhd. (30)(**) Malaysia9
  • Variscale Services & Engineering Singapore Pte. Ltd. (30)(*) Singapore9
  • Variscale Services & Engineering Taiwan Inc. Taiwan9
  • Variscale Services & Engineering, Inc. Delaware9
  • Xilinx AB Sweden9
  • Xilinx Armenia LLC Armenia9
  • Xilinx Asia Pacific Pte. Ltd. Singapore9
  • Xilinx Benelux B.V. Belgium9
  • Xilinx Canada Co. Canada9
  • Xilinx Development Corporation California9
  • Xilinx Dresden GmbH i.L. (1)(**) Germany9
  • Xilinx Finance Ireland Limited Ireland9
  • Xilinx GmbH Germany9
  • Xilinx Holding LLC Delaware9
  • Xilinx Holding Three Pte. Ltd. i.L. (1)(**) Singapore9
  • Xilinx Hong Kong Limited Hong Kong SAR, China9
  • Xilinx India Technology Services Private Limited India9
  • Xilinx Ireland Unlimited Company Ireland9
  • Xilinx Israel Limited Israel9
  • Xilinx Kabushiki Kaisha Japan9
  • Xilinx Limited United Kingdom9
  • Xilinx NI Limited United Kingdom9
  • Xilinx NL B.V. Netherlands9
  • Xilinx SARL France9
  • Xilinx Sales International Pte. Ltd. Singapore9
  • Xilinx Singapore Holding Pte. Ltd. Singapore9
  • Xilinx Technology Beijing Limited China9
  • Xilinx Technology Ltd. United Kingdom9
  • Xilinx Technology Shanghai Limited China9

From Wikidata.1 The subsidiaries the company lists in Exhibit 21 of its annual report, as filed.

Acquisitions

  1. 2006Acquired ATI Technologies1
  2. Succeeded NexGen1

Employees over time

AMD employees by year128.0K in 2025+215% since 2017
010.0K20.0K30.0K2017: 8.9K8.9K20172019: 11.4K11.4K2019+28%2021: 15.5K15.5K2021+36%2025: 28.0K28.0K2025+81%
  • 202528,0001
  • 202115,5001
  • 201911,4001
  • 20178,9001

Timeline

  1. Sep 28, 20268-K Unregistered sale of shares99
  2. Aug 19, 20268-K Executive or director change100
  3. Aug 17, 20268-K Entered a material agreement; New debt or obligation101
  4. Aug 4, 20268-K Results of operations; Regulation FD disclosure102
  5. Jul 1, 20268-K Executive or director change103
  6. May 15, 20268-K Entered a material agreement; Ended a material agreement; New debt or obligation104
  7. May 5, 20268-K Results of operations; Regulation FD disclosure105
  8. Feb 24, 20268-K Entered a material agreement; Unregistered sale of shares; Regulation FD disclosure106
  9. Feb 17, 20268-K Executive or director change107
  10. Feb 3, 20268-K Results of operations; Regulation FD disclosure108
  11. Jan 20, 20268-K Executive or director change109
  12. Dec 15, 20258-K Executive or director change110
  13. 2015Went public Listed on NASDAQ1
  14. Oct 8, 2014New chief executive Lisa Su becomes CEO1
  15. Aug 26, 2011New chief executive Rory P. Read becomes CEO23
  16. Feb 17, 2011New chief executive Thomas J. Seifert becomes CEO22
  17. Aug 12, 2008New chief executive Derrick R. Meyer becomes CEO24
  18. Nov 3, 2003New chief executive Bertrand F. Cambou becomes CEO26
  19. Aug 5, 2003New chief executive Hector Ruiz becomes CEO25
  20. May 1, 1969Founded Founded in Sunnyvale1

Calendar

Coming up

  1. Nov 3, 2026 · After the closeReports results for the quarter ending Sep/2026 A year earlier it reported $0.97 a share, on Nov 4, 2025.111

When it reported results

  1. Aug 4, 2026Reported quarterly or annual results102
  2. May 5, 2026Reported quarterly or annual results105
  3. Feb 3, 2026Reported quarterly or annual results108
  4. Nov 4, 2025Reported quarterly or annual results112
  5. Aug 5, 2025Reported quarterly or annual results113
  6. May 6, 2025Reported quarterly or annual results114
  7. Feb 4, 2025Reported quarterly or annual results115
  8. Oct 29, 2024Reported quarterly or annual results116

Upcoming dates from Nasdaq's calendar; past results from the company's 8-K filings (Item 2.02). The full markets calendar

Filings

603 filings to the SEC since October 2021: 6 annual reports, 15 quarterly reports, 66 major events, 356 insider forms, 8 large holders, 152 other. The latest 20:

  1. Oct 15, 2026144 EDGAR
  2. Sep 28, 20268-K EDGAR
  3. Sep 17, 20264 EDGAR
  4. Sep 15, 2026144 EDGAR
  5. Sep 14, 20264 EDGAR
  6. Sep 10, 2026144 EDGAR
  7. Sep 10, 2026144 EDGAR
  8. Aug 27, 20264 EDGAR
  9. Aug 26, 20264 EDGAR
  10. Aug 25, 2026144 EDGAR
  11. Aug 25, 2026144 EDGAR
  12. Aug 24, 2026144 EDGAR
  13. Aug 21, 20264 EDGAR
  14. Aug 20, 2026144 EDGAR
  15. Aug 20, 20264 EDGAR
  16. Aug 20, 20263 EDGAR
  17. Aug 20, 20264 EDGAR
  18. Aug 20, 20264 EDGAR
  19. Aug 19, 20268-K EDGAR
  20. Aug 18, 2026144 EDGAR

The 603 filings since October 2021 can be filtered by form type and year here when JavaScript is on.

Every filing from the last five years, summarized. The full record is on SEC EDGAR.

Insider trades

136 open-market trades by officers, directors and large owners since October 2021: 2 buys and 134 sales. Grants, option exercises and gifts are left out.

DateWhoTradeSharesPriceValueFiling
Sep 15, 2026Norrod Forrest EugeneEVP & GM DSGSale17,261$503.05$8.7MForm 4
Sep 10, 2026Su Lisa TChair, President & CEOSale95,000$506.80$48.1MForm 4
Aug 25, 2026Hu Jean X.EVP, CFO and TreasurerSale15,000$474.08$7.1MForm 4
Aug 24, 2026Norrod Forrest EugeneEVP & GM DSGSale17,261$459.95$7.9MForm 4
Aug 20, 2026Papermaster Mark DChief Technology Officer & EVPSale28,811$471.87$13.6MForm 4
Aug 18, 2026Su Lisa TChair, President & CEOSale15,000$480.94$7.2MForm 4
Aug 18, 2026Hahn AvaSVP, GC & Corporate SecretarySale2,993$488.69$1.5MForm 4
Aug 17, 2026GRASBY PAUL DARRENEVP & CSOSale15,000$514.91$7.7MForm 4
Aug 14, 2026Papermaster Mark DChief Technology Officer & EVPSale7,369$487.34$3.6MForm 4
Aug 11, 2026Hahn AvaSVP, GC & Corporate SecretarySale143$474.75$67.9KForm 4
Jul 15, 2026Papermaster Mark DChief Technology Officer & EVPSale6,000$556.43$3.3MForm 4
Jun 15, 2026Papermaster Mark DChief Technology Officer & EVPSale6,000$536.33$3.2MForm 4
Jun 10, 2026Su Lisa TChair, President & CEOSale125,000$460.69$57.6MForm 4
Jun 2, 2026Denzel NoraDirectorSale8,626$522.00$4.5MForm 4
May 29, 2026Denzel NoraDirectorSale1,821$522.00$950.6KForm 4
May 20, 2026Norrod Forrest EugeneEVP & GM DSGSale19,487$431.40$8.4MForm 4
May 15, 2026Papermaster Mark DChief Technology Officer & EVPSale6,000$433.79$2.6MForm 4
May 13, 2026Su Lisa TChair, President & CEOSale125,000$445.51$55.7MForm 4
May 8, 2026GRASBY PAUL DARRENEVP & CSOSale24,376$444.39$10.8MForm 4
Apr 24, 2026Papermaster Mark DChief Technology Officer & EVPSale31,320$350.00$11.0MForm 4

All 136 trades can be filtered by person here when JavaScript is on.

From Forms 4 filed with the SEC.

Major holders

Investors who own more than 5% of the shares must tell the SEC: a 13D if they may seek to influence the company, a 13G if they hold passively.

Executive pay

What the company paid its top executives, from the summary compensation table in its proxy statement. Total pay includes salary, bonus, stock and option awards and other pay, as the company valued them.

YearExecutiveAgeSalaryTotal pay
2025ChairPresident and Chief Executive Officer$1.3M$55.2M120
2025Executive Vice President and Chief Technology OfficerTechnology and Engineering$854.9K$16.6M120
2025Executive Vice PresidentChief Financial Officer and Treasurer$779.8K$14.3M120
2025Executive Vice President and General ManagerData Center Solutions Business$764.9K$13.5M120
2024ChairPresident and Chief Executive Officer$1.2M$31.0M120
2024Executive Vice President and Chief Technology OfficerTechnology and Engineering$820.0K$11.2M120
2024Executive Vice PresidentChief Financial Officer and Treasurer$742.5K$9.1M120
2024Executive Vice President and General ManagerData Center Solutions Business$730.0K$8.1M120
2023Executive Vice PresidentChief Financial Officer and Treasurer$683.2K$32.8M120
2023ChairPresident and Chief Executive Officer$1.2M$30.3M120
2023Executive Vice President and General ManagerData Center Solutions Business$693.5K$15.8M120
2023Executive Vice President and Chief Technology OfficerTechnology and Engineering$787.5K$11.4M120

Held by these funds

The largest holders among investment managers' 13F reports for the quarter ending Jun 30, 2026, the top 25 of 100. Change is in shares since the quarter before.

FundSharesValueShare of the fundChange
BlackRock, Inc.150,301,510$87.3B1.3%+4,727,226
Vanguard Capital Management LLC106,500,177$61.9B1.3%+559,911
State Street Corp74,361,687$43.2B1.3%−409,533
Invesco Ltd.53,171,203$30.9B2.4%+2,728,005
Geode Capital Management, LLC39,568,601$22.9B1.2%−222,485
Vanguard Portfolio Management LLC37,929,920$22.0B1.0%+326,245
Jpmorgan Chase & Co40,309,233$21.7B1.3%+16,060,686
Fmr LLC25,558,552$14.8B0.6%+10,269,781
Morgan Stanley24,286,371$14.1B0.7%+504,763
Norges Bank23,361,170$13.6B1.4%New
UBS AM, a distinct business unit of UBS ASSET MANAGEMENT AMERICAS LLC17,548,481$10.2B1.9%−1,644,283
Northern Trust Corp16,689,593$9.7B1.1%+262,376
Goldman Sachs Group Inc14,755,674$8.6B0.9%+2,472,578
Bank Of America Corp /de/12,088,320$7.0B0.5%+1,926,839
Charles Schwab Investment Management Inc12,016,903$7.0B0.9%+116,272
Amundi11,409,427$6.6B1.6%−2,271,529
Legal & General Group Plc10,979,868$6.4B1.3%−282,901
Assenagon Asset Management S.A.10,640,150$6.2B4.0%+5,926,243
Bank of New York Mellon Corp10,224,506$5.9B1.0%−129,575
Jennison Associates LLC9,972,952$5.8B3.5%+545,575
Van Eck Associates Corp9,486,389$5.5B3.4%−2,592,368
Vanguard Fiduciary Trust Co9,369,499$5.4B1.2%+61,515
Wellington Management Group Llp9,334,396$5.4B0.9%+2,365,419
Franklin Resources Inc9,093,264$5.3B1.2%+4,782,691
Barclays PLC8,297,385$4.8B1.5%−3,168,152

13F reports cover disclosed long positions in U.S. stocks only.

Members of Congress who traded it

109 trades disclosed by members of Congress, the latest 25. “Vs S&P since” is the stock’s change since the trade minus the S&P 500’s.

DateMemberTradeAmountVs S&P sinceFiling
Aug 18, 2026Gilbert Ray Cisneros, Jr.Democratic, HousePartial sale$1,001 - $15,000−8.6%Report
Jul 17, 2026Gilbert Ray Cisneros, Jr.Democratic, HouseBuy$1,001 - $15,000+2.8%Report
Jul 14, 2026Rick W. AllenRepublican, HouseBuy$1,001 - $15,000−6.2%Report
Jul 10, 2026Dan NewhouseRepublican, HousePartial sale$1,001 - $15,000+7.5%Report
Jun 5, 2026Gilbert Ray Cisneros, Jr.Democratic, HouseBuy$1,001 - $15,000+8.7%Report
May 15, 2026Gilbert Ray Cisneros, Jr.Democratic, HouseBuy$1,001 - $15,000+20.3%Report
May 14, 2026Gilbert Ray Cisneros, Jr.Democratic, HouseBuy$1,001 - $15,000+14.4%Report
May 5, 2026Josh GottheimerDemocratic, HouseBuy$1,001 - $15,000+42.2%Report
Apr 27, 2026Josh GottheimerDemocratic, HouseBuy$1,001 - $15,000+50.1%Report
Apr 23, 2026Josh GottheimerDemocratic, HouseBuy$1,001 - $15,000+64.2%Report
Apr 14, 2026Gilbert Ray Cisneros, Jr.Democratic, HouseBuy$15,001 - $50,000+96.2%Report
Mar 27, 2026Alan ArmstrongRepublican, SenateBuy$15,001 - $50,000+140.1%Report
Mar 13, 2026Gilbert Ray Cisneros, Jr.Democratic, HousePartial sale$1,001 - $15,000−156.9%Report
Feb 18, 2026Thomas R. SuozziDemocratic, HouseSale$1,001 - $15,000−151.8%Report
Feb 10, 2026Gilbert Ray Cisneros, Jr.Democratic, HouseBuy$1,001 - $15,000+136.1%Report
Feb 3, 2026Cleo FieldsDemocratic, HouseBuy$50,001 - $100,000+106.5%Report
Feb 2, 2026Julia LetlowRepublican, HouseBuy$1,001 - $15,000+103.7%Report
Dec 19, 2025Gilbert Ray Cisneros, Jr.Democratic, HousePartial sale$15,001 - $50,000−134.3%Report
Nov 18, 2025Gilbert Ray Cisneros, Jr.Democratic, HouseBuy$15,001 - $50,000+112.7%Report
Oct 31, 2025Lisa C. McClainRepublican, HouseSale$1,001 - $15,000−93.3%Report
Oct 30, 2025Lisa C. McClainRepublican, HouseBuy$1,001 - $15,000+94.0%Report
Oct 30, 2025Lisa C. McClainRepublican, HouseSale$1,001 - $15,000−94.0%Report
Aug 18, 2025Dan NewhouseRepublican, HouseBuy$1,001 - $15,000+180.2%Report
Aug 15, 2025Cleo FieldsDemocratic, HouseBuy$15,001 - $50,000+177.9%Report
Aug 7, 2025John BoozmanRepublican, SenateBuy$1,001 - $15,000+184.6%Report

Members report amounts as ranges, not exact figures. Returns are price-only (no dividends).

SEC filer profile

How AMD is registered with the Securities and Exchange Commission, from its EDGAR record and the cover page of its latest annual report.

  • Name on EDGARADVANCED MICRO DEVICES INC2
  • CIK0000002488
  • Employer ID (EIN)94-169230020
  • Filer statusLarge accelerated filer not an emerging growth company; not a smaller reporting company; not a shell company20
  • Incorporated inDelaware20
  • Fiscal year endsDecember 262
  • Industry code (SIC)3674 Semiconductors & Related Devices2
  • SEC reviewing officeOffice of Manufacturing, Division of Corporation Finance2
  • Business address2485 Augustine Drive, Santa Clara, CA 950542
  • Phone(408) 749-40002
  • Shares outstanding1,632,475,042 as of Jul 29, 202618
  • Public float$232.3B as of Jun 28, 202420
  • AuditorErnst & Young LLP, San Jose, California PCAOB ID 42; it also attests to the company’s internal control over financial reporting20
  • On EDGAR sinceJan 27, 19942
  • Filings3,326 in all: 4 (2,015), 8-K (424), 144 (104), 10-Q (98), SC 13G/A (93), 3 (65), DEF 14A (35), DEFA14A (34)2
    All 63 form types

    SC 13G (34), UPLOAD (31), 10-K (29), S-8 (29), 8-K/A (27), CORRESP (24), 4/A (22), 424B5 (18), CT ORDER (17), 424B3 (15), 5 (15), POS AM (15), SC 13D/A (15), SC TO-I/A (14), SD (13), 10-Q/A (9), S-3ASR (9), 10-K/A (8), PRE 14A (7), S-4 (7), S-4/A (7), 10-K405/A (6), EFFECT (6), PRER14A (6), S-3/A (6), 425 (5), S-3 (5), SC TO-I (5), 10-K405 (4), ARS (4), FWP (4), S-8 POS (4), 13F-HR (3), SC 13D (3), SC TO-C (3), 15-12G (2), 15-15D (2), 3/A (2), 305B2 (2), 424B2 (2), AW (2), DEFR14A (2), IRANNOTICE (2), SEC STAFF LETTER (2), 25 (1), 5/A (1), 8-A12B (1), CERTNAS (1), DEFM14A (1), NO ACT (1), POS EX (1), S-4MEF (1), SC TO-T (1), SCHEDULE 13G (1), SCHEDULE 13G/A (1)

  • Latest filingsAnnual report (10-K) Feb 4, 2026
    Quarterly report (10-Q) Aug 5, 2026
    Proxy statement (DEF 14A) Mar 27, 2026
    Latest 8-K (8-K) Sep 28, 2026

Securities registered for trading

ClassSymbolExchange
Common Stock, $0.01 par value per shareAMDThe NASDAQ Global Select Market

From the cover page of the 10-K filed Feb 4, 2026 (Section 12(b) of the Exchange Act).20

Risk factors and legal proceedings

The risks AMD names in Item 1A of its 10-K filed Feb 4, 2026: 42 risks under these headings, as written.20

  • The risks and uncertainties described below are not the only ones we face. If any of the following risks actually occurs, our business, financial condition or results of operations could be materially adversely affected. In addition, you should consider the interrelationship and compounding effects of two or more risks occurring simultaneously.
  • Economic and Strategic Risks
  • Operational and Technology Risks
  • Legal and Regulatory Risks
  • Merger, Acquisition, Divestiture, and Integration Risks
  • General Risks
  • The markets in which our products are sold are highly competitive and rapidly evolving.
  • The semiconductor industry is highly cyclical and has experienced severe downturns that have materially adversely affected, and may continue to materially adversely affect, our business in the future.
  • The demand for our products depends in part on the market conditions in the industries into which they are sold. Fluctuations in demand for our products or a market decline in any of these industries could have a material adverse effect on our results of operations.
  • The success of our business depends on our ability to introduce products on a timely basis with features and performance levels that provide value to our customers while supporting and coinciding with significant industry transitions.
  • The loss of a significant customer may have a material adverse effect on us.
  • Economic and market uncertainty may adversely impact our business and operating results.
The other 35 risks
  • Our operating results are subject to quarterly and seasonal sales patterns.
  • If we cannot adequately protect our technology or other intellectual property in the United States and abroad, through patents, copyrights, trade secrets, trademarks and other measures, we may lose a competitive advantage and incur significant expenses.
  • Unfavorable currency exchange rate fluctuations could adversely affect us.
  • We rely on third parties to manufacture our products, and if they are unable to do so on a timely basis in sufficient quantities and using competitive technologies, our business could be materially adversely affected.
  • If essential equipment, materials, substrates or manufacturing processes are not available to manufacture our products, we could be materially adversely affected.
  • Failure to achieve expected manufacturing yields for our products could negatively impact our results of operations.
  • Our revenue from our semi-custom SoC products is dependent upon our semi-custom SoC products being incorporated into customers’ products and the success of those products.
  • Our products may be subject to security vulnerabilities that could have a material adverse effect on us.
  • IT outages, data loss, data breaches and cyberattacks could disrupt operations and compromise our intellectual property or other sensitive information, be costly to remediate or cause significant damage to our business, reputation, financial condition and results of operations.
  • Uncertainties involving the ordering and shipment of our products could materially adversely affect us.
  • Our ability to design and introduce new products in a timely manner includes the use of third-party intellectual property.
  • We depend on third-party companies for the design, manufacture and supply of motherboards, software, memory and other computer platform components to support our business and products.
  • If we lose Microsoft Corporation’s support for our products or other software vendors do not design and develop software to run on our products, our ability to sell our products could be materially adversely affected.
  • Our reliance on third-party distributors and AIB partners subjects us to certain risks.
  • Our business depends on the proper functioning of our internal business processes and information systems and modification or interruption of such systems may disrupt our business, processes and internal controls.
  • If our products are not compatible with some or all industry-standard software and hardware, we could be materially adversely affected.
  • Costs related to defective products could have a material adverse effect on us.
  • If we fail to maintain the efficiency of our supply chain as we respond to changes in customer demand for our products, our business could be materially adversely affected.
  • We outsource to third parties certain supply-chain logistics functions, including portions of our product distribution, transportation management and information technology support services.
  • Our inability to effectively control the sales of our products on the gray market could have a material adverse effect on us.
  • Climate change may have an impact on our business.
  • Government actions and regulations such as export regulations, import tariffs, and trade protection measures may limit our ability to export our products to certain customers.
  • If we cannot realize our deferred tax assets, our results of operations could be adversely affected.
  • We are party to litigation and may become a party to other claims or litigation that could cause us to incur substantial costs or pay substantial damages or prohibit us from selling our products.
  • We are subject to environmental laws, conflict minerals regulations, as well as a variety of other laws or regulations that could result in additional costs and liabilities.
  • Evolving expectations from governments, investors, customers and other stakeholders regarding corporate responsibility matters could result in additional costs, harm to our reputation and a loss of customers.
  • Issues related to the responsible use of AI may result in reputational, competitive and financial harm and liability.
  • The agreements governing our notes, our guarantee of the Assumed Xilinx Notes and the Revolving Credit Agreement impose restrictions on us that may adversely affect our ability to operate our business.
  • We may be required to satisfy financial obligations under guarantees and other commercial commitments.
  • Acquisitions, joint ventures, and/or investments, and the failure to integrate acquired businesses, may fail to materialize their anticipated benefits and could disrupt our business, which could adversely affect our results of operation and financial condition.
  • Any impairment of our tangible, definite-lived intangible or indefinite-lived intangible assets, including goodwill, may adversely impact our financial position and results of operations.
  • Our worldwide operations are subject to political, legal and economic risks and natural disasters, which could have a material adverse effect on us.
  • We may incur future impairments of our technology license purchases.
  • Our inability to continue to attract and retain key employees may hinder our business.
  • Our stock price is subject to volatility.

Legal proceedings

For a discussion of our legal proceedings, refer to Note 12 – Commitments and Contingencies of the Notes to Consolidated Financial Statements (Part II, Item 8 of this Form 10-K).

The opening of Item 3, Legal Proceedings.20

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