Private company

Qimonda

2006–2011 German computer memory manufacturer

Qimonda AG ( kee-MOHN-də) was a German memory company split out of Infineon Technologies (itself a spun off business unit of Siemens AG) on 1 May 2006 to form at the time the second largest DRAM company worldwide, according to the industry research firm Gartner Dataquest. It was a patent licensing firm until Micron and others purchased its patents. Headquartered in Munich, Qimonda was a 300 mm manufacturer and was one of the top suppliers of DRAM products for the PC and server markets.2 It was founded in 2004.1 It ceased to exist in 2009.1 Wikipedia text CC BY-SA 4.0

Last updated Oct 21, 2026.

Overview

2004Founded1
  • HeadquartersMunich1
  • Websitewww.qimonda.com
  • Legal formAktiengesellschaft1
  • Listed onNew York Stock Exchange1
Sapphire Ultimate HD 4670 512MB - Qimonda HYB18H512321BF-10-93577
Photo: Raimond Spekking, CC BY-SA 4.0, via Wikimedia Commons4

Qimonda AG ( kee-MOHN-də) was a German memory company split out of Infineon Technologies (itself a spun off business unit of Siemens AG) on 1 May 2006 to form at the time the second largest DRAM company worldwide, according to the industry research firm Gartner Dataquest. It was a patent licensing firm until Micron and others purchased its patents. Headquartered in Munich, Qimonda was a 300 mm manufacturer and was one of the top suppliers of DRAM products for the PC and server markets. Infineon still controlled a 77.5% stake in 2008, which it later wrote down. Infineon was on record as having the aim of divesting itself of this stake, with the purpose of becoming a minority stakeholder in 2009. The company issued 42 million ADR shares, each ADR share representing one ordinary share in Qimonda.2

Products and brands

  • computer memory

Listed on Wikidata.1

Products and achievements

Qimonda produced computing and consumer DRAM, graphics RAM, mobile RAM and Flash memory.

Qimonda was primarily reliant on its Deep Trench technology in comparison to the stack capacitor systems of its rival manufacturers. Deep Trench has the benefit of a theoretically smaller footprint than its stack capacitor rival. With approximately one-third lower power consumption due to lower leakage currents, its advantages lie in mobile and laptop applications where power supply is a limiting factor. Although offering significant advantages, deep trench technology is technically difficult to manufacture and has led to slippage of Qimonda's technology shrink roadmap in comparison to many of its rivals in recent years.

In 2008, Qimonda announced the development of its Buried Wordline Technology. Retaining many of the advantages of Deep Trench technology, in theory it simplifies the manufacturing process and the time provided Qimonda with a competitive technology shrink roadmap. All 200 mm manufacturing ended by January 2009.

On September 18, 2006, Qimonda AG along with Nanya Technology Corporation announced the successful qualification of the 75 nm DRAM trench technology. Process structures of 75 nm further reduce chip size compared to the previous 90 nm technology thereby increasing potential chip output per wafer by about 40 percent.

Read the full text

On November 1, 2007, Qimonda AG announced shipment of first GDDR5 samples.

On February 3, 2009, Qimonda AG announced the first 46 nm working production chips using its Buried Wordline technology, fabricated at its Dresden 300 mm plant.

Production sites

Dresden, Germany

Vila do Conde, Portugal. This factory was for some years (up to 2007) the biggest Portuguese exporter.

Richmond, Virginia, United States. (Ceased operation and was closed on April 1, 2009.)

Senai, Johore, Malaysia.

From Wikipedia’s article on Qimonda, shared under CC BY-SA 4.0.3

Timeline

  1. 2009Dissolved Dissolved1
  2. 2004Founded Founded1

Sources

The numbers on this page point here. Each one links to the record it came from.

  1. 1
  2. 2
  3. 3
  4. 4